Automatic line of surface mounting components installation with a capacity of up to 50 000 components per hour mounted on a printed circuit board up to 500 x 400 mm.
The automatic line of our company is equipped with the following devices:
|Minimum print cycle time||14 sec|
|Maximum print area size (L x W)||500 x 498 mm|
|PCB thickness||0.4 - 6 mm|
|Speed of movement of the doctor knife 2||150 mm/sec|
|PCB and stencil alignment repeatability||±25 for 1.33 cpk µm|
|Maximum capacity (IPC 9850)||21000 sets/hour|
|Installation accuracy (at 3σ), chip components||± 50 µm of chips ± 30 µm|
|Maximum number of part types made of tape||8 mm 120 pcs|
|Maximum clearance above/below the board||35/25 mm|
|Total working area length||2450 mm|
|Number/total length of heating zones||6/1650 mm|
|Number/total length of active cooling zones||2/800 mm|
|Inspection speed||up to 20 cm2/sec|
|Electrical monitoring method||four "flying probes" testing|
|Resolution||3 µm, X-axis Y-axis|
|Repeatability||± 3 µm|
|Min. contact area width||30 мкм.|
Our manufacturing capability allows us to carry out automatic installation of chip components with the minimum size of the case 01005 (400×200 microns), microcircuits with lead pitch from 0.3 mm, as well as a number of complex elements, including the installation of BGA and micro BGA with a number of outputs up to 3600, electrolytic capacitors, connectors, quartz resonators and other elements designed for SMD installation.
Installation and soldering of electronic components is carried out using the latest achievements of well-known international companies, modern automatic equipment, advanced technological processes and materials. Highly automated surface mounting lines allow fast and accurate installation of all types of electronic components of the following types of bearers: coils of 8, 12, 16 and 24 mm, cases of any width, matrix trays.