Automated assembly of printed circuit boards

Automatic line of surface mounting components installation with a capacity of up to 50 000 components per hour mounted on a printed circuit board up to 500 x 400 mm.

The automatic line of our company is equipped with the following devices:

DEK HORYZON 03 i screen printing machine (UK)

Автомат трафаретной печати DEK HORYZON 03 i (Великобритания) (Рис. 1)

Minimum print cycle time	14 sec
Maximum print area size (L x W)	500 x 498 mm
PCB thickness	0.4 - 6 mm
Speed of movement of the doctor knife 2	150 mm/sec
PCB and stencil alignment repeatability	±25 for 1.33 cpk µm

SAMSUNG SM 412 high-performance automatic machine of installation (South Korea)

Автомат установки SAMSUNG SM 412 (Ю. Корея) (Рис. 2)

Maximum capacity (IPC 9850)	21000 sets/hour
Installation accuracy (at 3σ), chip components	± 50 µm of chips ± 30 µm
Maximum number of part types made of tape	8 mm 120 pcs

ERSA HOTFLOW 2|12 melting furnace (Germany)

Печь оплавления ERSA HOTFLOW 2|12 (Германия) (Рис. 3)

Maximum clearance above/below the board	35/25 mm
Total working area length	2450 mm
Number/total length of heating zones	6/1650 mm
Number/total length of active cooling zones	2/800 mm

Vantage S 22 (Israel) automatic optical inspection of assembled units

Автоматическая оптическая проверка собранных узлов Vantage S 22 (Израиль) (Рис. 4)

Inspection speed	up to 20 cm²/sec
Inspection method	DPIX
Camera	2 MPix

Aerial M4 manufacturing defects analyzer produced by Seica (Italy)

Анализатор производственных дефектов Aerial M4 фирмы Seica (Италия) (Рис. 5)

Electrical monitoring method	four "flying probes" testing
Resolution	3 µm, X-axis Y-axis
Repeatability	± 3 µm
Min. contact area width	30 мкм.

Our manufacturing capability allows us to carry out automatic installation of chip components with the minimum size of the case 01005 (400×200 microns), microcircuits with lead pitch from 0.3 mm, as well as a number of complex elements, including the installation of BGA and micro BGA with a number of outputs up to 3600, electrolytic capacitors, connectors, quartz resonators and other elements designed for SMD installation.

Installation and soldering of electronic components is carried out using the latest achievements of well-known international companies, modern automatic equipment, advanced technological processes and materials. Highly automated surface mounting lines allow fast and accurate installation of all types of electronic components of the following types of bearers: coils of 8, 12, 16 and 24 mm, cases of any width, matrix trays.