Manufacture of printed circuit boards

Contract manufacturing of JSC «Penza Industrial Corporation «Electropribor» produces double-sided printed-circuit boards (PCB) by combined positive method and multilayer printed-circuit boards (MPCB) by method of metallization of through holes.

maximum workpiece size is 400 × 500 mm;
maximum number of multilayer printed-circuit boards layers - 20;
minimum conductor width - 0.07 mm;
guarantee belt - 0.025 mm;
minimum diameter of a metallized hole - 0.2 mm;
ratio of the hole diameter/thickness of the board is 1:10.

The quality of products is ensured by the use of high-tech equipment, carefully selected and integrated into a single technological chain, as well as repeated technical control on specialized equipment, periodic reliability tests (twice per year):

production of photomasks on a high-precision laser photoplotter "First EIE" (Switzerland) (pic. 1), with a line of development "Multi Line" (Holland);
"Lenz" drilling machines (pic. 2) and "Schmoll" milling machines (pic. 3) (Germany);
"Hoellmueller Maschinenbau GmbH" stripping machine (Germany) for printed circuit boards;
"Pill" installation (Germany) for permanganate treatment of holes in multilayer printed-circuit boards;
"Targomat ІІІ" installation (Switzerland) for drilling of technological apertures in layers and in multilayer printed-circuit boards;
"OLEC" installation (USA) for multilayer printed-circuit boards layer exposure (pic. 4);
installation for etching printed circuit boards and layers produced by “Depeltronic” company (Spain) with regeneration by “Elochem” company (Germany) (pic. 5)
Installation for development by “Depeltronic” (Spain); (pic. 6)
installation for hot tinning by "Laif Engineering" (Germany);
"Wise" installation (Italy) for printed circuit boards cleaning;
"Pill" installation (Germany) for metal resist removal (pic. 7);
"Seica" installation (Italy) for electrical continuity test of printed circuit boards (pic. 8);
"ATMA" installation (Taiwan) for liquid mask application (pic. 9);
"Thiem" installation (Germany) to mark signals on a printed circuit board surface (pic. 9).

[Рис. 1] Высокоточный лазерный фотоплоттер «First EIE» (Швейцария)

[Рис. 3] Станок для фрезерования «Schmoll» (Германия)

[Рис.4] Установка экспонирования слоев МПП фирмы «OLEC» (США)

[Рис. 5] Установка травления ПП и слоев фирмы «Depeltponic» (Испания) с регенерацией фирмы «Elochem» (Германия)

[Рис. 6] Установка проявления фирмы «Depeltponic» (Испания)

[Рис. 7] Установка снятия металлорезиста фирмы «Pill» (Германия)

[Рис. 8] Установка электрической прозвонки ПП «Seica» (Италия)

[Рис. 9] Установка нанесения знаков на поверхности ПП фирмы «Thiem» (Германия)

Domestic and import materials used to manufacture printed circuit boards include: unilateral and bilateral glass textolite FR-4 0.1; 0.15; 0.2; 0.23; 0.25; 0.51; 1; 1.5 mm thick with copper foil of 18 and 35 microns thick produced by "Isola" (Germany);

glass textolite STF (foiled) meeting the requirements of the engineering specification 16-503. 161-83 for double-sided printed-circuit boards;
prepreg 1080 AT 01 produced by "Isola" (Germany);
DYNAMASK KM dry film protective photoresist produced by "Schipley" (USA);
TAIYO PRS-4000 H855/CA - 40 H 855 (Taiwan) liquid photosensitive thermosetting protective solder mask;
Riston photoresist produced by "DuPont" (Germany);
chemicals produced by “Shipley” (England), “MacDermid” (USA), etc.

The printed-circuit boards department provides in full the enterprise with the given production and has possibility to take orders of third-parties.

Production capacity of the printed-circuit boards department is up to 500 sq.m. per month.

Pricing details